PCB抄板,芯片解密,SMT加工,样机制作,IC解密
 
 
公司介绍 新闻中心 PCB抄板 PCB生产 芯片解密 样机制作 成功案例 软件下载
 
PCB抄板,PCB改板,SMT加工,IC解密,PCB生产,样机制作
 
主营项目: PCB抄板,PCB改板,PCB生产,IC解密,样机制作
·最新公告                       点击进入 >>
深科特PCB抄板芯片解密PCB生产企业-为您提供最专业的PCB抄板、芯片解密、PCB生产、样机制作服务,以超强的技术实力成为PCB抄板、芯片解密、PCB生产、IC解密行业界的领跑者。
    任何样板,均可100%保证一次性克隆成功!
 
设计能力     
1   最高速信号:3.125G差分信号
2   最高设计层数:38层
3   最大Connections:18564
4   最大PIN数目:26756
5   最小过孔:8MIL(4MIL激光孔)
6   最小线宽:3MIL
7   最小线间距:4MIL
8   最小BGA PIN间距:0.5mm
9   一块PCB板最多BGA数目:30
10   最大的板面积:640mm*580mm
 
PCB抄板      
·
PCB改板
·
PCB抄板反向推理
·
PCB生产/批量生产
·
BOM清单制作
芯片解密
·
IC解密技术力量
·
单片机解密
·
软件破解
·
芯片反向设计
SMT加工
·
SMT贴片加工
·
OEM/ODM加工
·
元器件采购
·
SMT焊接调试
样机制作
·
样机功能调测
·
样机功能修改
·
元器件仿真
·
疑难器件/模块替换
成功案例
· 不锈钢高压灭菌锅之专业电路板抄板仿制
· 磷化氢气体检测仪之深科特pcb抄板及
· 电路板抄板及软硬件仿制开发案例之万用
· 化学发光定氮之pcb抄板及整机仿制案
· 便捷式光泽度仪之深科特抄板仿制及SM
· 热风净手器之pcb抄板及芯片解密成功
· 专业电路板抄板仿制及软硬件开发案例之
· 微功耗测控终端之深科特pcb抄板及批
· 便携式码流分析仪之电路板抄板仿制及逆
· 深科特专业PCB抄板仿制及反向研发之
 当前位置:首页 > 集成电路
日期:2008-10-20 14:55:25 

SAFC HitechTM, a focus area within SAFC®, a member of the Sigma-Aldrich Group , today announced that it has made significant progress in developing Germanium Antimony Telluride (GexSbyTez or GST) precursors for use in high volume manufacturing phase change memory (PCM) applications. Extensive development work has been conducted with both the precursors and with the use of conventional Metal-Organic Chemical Vapor Deposition (MOCVD) techniques to deposit them, resulting in the successful deposition of device-quality GST. These advances represent a major step towards achieving a commercially-viable solution to address the aggressive memory device scaling issues faced by the semiconductor industry to keep pace with Moore’s Law.

PCM, a non-volatile computer memory, takes advantage of the unique behavioral properties of chalcogenide compounds to enable scaling of ultimate feature size further than is possible with conventional Flash memories[1]. This translates to greater storage capacity and superior performance for memory devices. Chalcogenide compounds, such as GST, are very attractive materials for PCM and have already been used as the basis for optical storage media and prototype PCM devices.

“Until now, PCM materials have generally been deposited by sputtering or other Physical Vapor Deposition (PVD) techniques, which are line of sight methods and have inherent weaknesses relating to uniformity of deposition,” commented SAFC Hitech Chief Technology Officer, Ravi Kanjolia. “Vapor phase deposition techniques, such as MOCVD, offer several advantages in relation to GST precursors, in particular, a better step coverage for deposition on patterned substrates, industrial scaling and high compositional control. Furthermore, we have achieved advances in precursor chemistries that allow similar layers to be deposited using conventional MOCVD, without the need for an activation process.”

Since 2005, SAFC Hitech has been a participant in the European Commission-supported CHEMAPH project, a consortium set up to look at deposition methods for GST films. Researchers at the company’s Bromborough facility in the UK have been actively investigating a variety of GST sources suitable for MOCVD, and have matched the physical properties of each metal precursor to enhance efficiencies at the desired growth parameters.

“Variations in cracking efficiencies were one major hurdle that we had to overcome,” explained Kanjolia. “After extensive work to synthesise a number of different chemicals and characterize their physical properties, a combination of sources was found with a much improved match of thermal stability to allow decomposition to the same degree when simultaneously introduced to the deposition reactor chamber.”

The actual chemicals of choice were found to be Ge(NMe2)4, Sb(NMe2)3 and iPr2Te. With these identified, SAFC Hitech then developed synthesis protocols to allow the isolation of high purity product in both small and large laboratory scale equipment. These materials are now available to customers with guaranteed quality by state-of-the-art in-house analysis. Samples have been shipped to various centers, and collaborations with partners have taken place to test the different combinations. Recent growth trials have resulted in successful deposition of device-quality GST using nitrogen as a carrier gas. 

“While a full process to make MOCVD devices remains to be demonstrated on anything other than very small research structures, the quality of the films on flat substrates is improving, and the precursor chemistry is ideally-suited,” concluded Kanjolia. “The next challenge is to get the correct parameters in place to control the growth and lay down the correct layers in the correct structure. The temperature window with this process remains critical, and highlights both the difficulties associated with this system and the need for advanced precursors to move forward with integration into future phase change memory applications. We are confident that our sources will allow the development of next-generation devices to maintain the speed of performance enhancement required to meet market targets.”

关键字: PCB抄板 PCB生产 IC解密 样机制作 芯片解密 pcb板 SMT加工
 
·上一篇文章: 三星中国第二座液晶模组厂敲定苏州
 
·下一篇文章: Watlow推出IFC加热器 帮助太阳能电池工艺实现温度一致性
Copyright 2002-2010 版权所有 深科特集团-深圳市银禾金达科技有限公司
深科特集团——PCB抄板 PCB生产 芯片解密 BOM清单制作 原理图反推 样机调试加工 成品量产
业务部 电话:0755-83766239 83766142 82920849(负责PCB抄板,PCB生产,方案设计,IC解密,成品生产等业务)
空气净化机 远大空气净化机 陈克明面条 巴马科养水 家用净水壶
pcb抄板
pcb抄板
pcb抄板