美国Veeco Instruments公司日前发布一款新Insight全自动三维原子力显微镜（3DAFM ）平台，专为32nm和22nm节点光掩膜高精度的3维量测而设计。InSight 3DAFM-PM具有无与伦比的精确度和精密度，同时它又是一种无损测量，并且能够做高解析度三维量测，特别适于量测45nm和32nm的半导体晶片的特征尺寸，测量不确定性极低。
Veeco Instruments Inc. (Nasdaq: VECO), a leading provider of instrumentation to the nanoscience community, today introduced a new version of its InSight(TM) 3D Automated Atomic Force Microscope (3DAFM) specifically designed to deliver accurate three-dimensional metrology on advanced 32nm and 22nm photomasks. The
InSight 3DAFM-PM incorporates a number of hardware and software enhancements to provide high throughput and sub-nanometer measurement uncertainty for critical dimension (CD) and depth metrology on a variety of photomask features and material types. In addition to semiconductor applications, the InSight 3DAFM-PM has been designed to meet the hard disk drive industry's challenging metrology requirements as it incorporates nano-imprint masks in new patterned media technology.
Mark R. Munch, Ph.D., Executive Vice President, Veeco Metrology commented, "The InSight 3DAFM-PM tool stands alone in its ability to provide non-destructive three dimensional profile metrology and production-based depth metrology for advanced masks. The system also enables significant improvements in cost of ownership, with improved throughput and a significant reduction in cost per measurement for CD metrology."
"The InSight 3DAFM-PM has already demonstrated capability on advanced 22nm node nano-imprint masks and is unique in its ability to measure accurate profile on this technology," states Paul Clayton, Vice President, Veeco's Automated AFM Business. "In addition, this platform enables process development times to be improved with full profile characterization of resist and MoSi structures as well as chrome and other mask materials."
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